By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern ...
Key TakeawaysTSMC’s gross margin expanded from 59% in the June 2025 quarter to 68% in June 2026, even as management guided the next quarter down to 66% on 2 nanometer ramp dilution, a step back that ...
Manpower is key for making enough chips to power AI, but a new report shows the U.S. now faces a shortage of up to 157,000 ...
TSMC advances its semiconductor lead over Samsung with 1.4nm trial production planned for Q1 2027, as the AI boom pushes 3nm ...
As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.
Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu ...
On 8, 2026, Reuters reported that ASML Holding N.V. (NASDAQ:ASML) plans to work with major customers. It includes Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM), Nvidia, Intel, Samsung, ...
TSMC is expanding advanced-packaging capacity as demand from Nvidia and other chip designers continues to rise. KLA, Camtek, ...
As AI demand drives growth in advanced packaging, TSMC is strengthening equipment and materials validation across its supply ...
TSMC is part of a broader picture of Taiwan-U.S. economic engagement. From 2015 to 2025, bilateral goods trade almost ...
TSMC’s adoption of ASML’s advanced EUV machines highlights the extraordinary technology underpinning increasingly powerful AI ...
TSMC is up over 66% in the past year, AI customers are booking capacity years out, and the only foundry rival is hemorrhaging ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results