We invite power electronics professionals to scan this eBook to gain insights into the cutting-edge developments around grid modernization and energy infrastructure.

As power systems become more distributed, verifying power rail sequencing and ripple behavior is more difficult with limited ...

The new devices combine low RDS(ON), high drain current and wettable flanks for compact, high-density automotive power designs. Taiwan Semiconductor Corporation (TSC) has expanded its TQM Series of ...

The new 20A module integrates IGBTs, drivers and protection in an 18.8mm × 32.8mm DBC package for compact inverter designs.

AI data centers and electrification are transforming the traditional power grid into a decentralized, multidirectional ecosystem.

The new IC consumes less than 0.75mW at 230VAC and supports AC-DC designs with X-capacitance from 100nF to 6μF.

The new rectifiers improve thermal performance and surge capability while supporting automated optical inspection in compact ...

YMIN supercapacitors gain UL 810A component recognition, helping simplify compliance, reduce project risks, and support North American applications.

Vertical Semiconductor's CEO discusses scaling FinFET vertical GaN on engineered substrates for AI data center power ...

The system combines 12 A/µs current dynamics, 95% energy recovery and scalable power to 1,920 kW for advanced power-system ...

This PowerUP Circuit Lab walks through a complete six-stage PoE powered-device chain from raw input to isolated 12 V output.