Ambarella has rolled out a cluster of edge AI announcements centered on its new X7 accelerator, alongside expanded developer ...

Semtech has introduced a family of 224G linear transimpedance amplifiers and drivers for near-packaged optics (NPO) and co-packaged optics (CPO) in AI/ML clusters, data centers and networking systems.

Tektronix is rolling out two additions aimed squarely at high-speed serial and data center power validation work. The 7 Series DPO now tops out at 25 GHz across eight channels and a sample rate that ...

Level VII efficiency standards don’t appear to be coming any time soon. Designers need to prepare today for that possibility. The previously anticipated strict performance requirements were inspired ...

Rambus is shipping a CryptoManager Root of Trust built to work with the open-source Caliptra specification, aimed at data ...

Considered too expensive to deploy at scale in mobile networks, mmWave technologies are appearing in other use cases. When ...

Bruno Damien, Ecosystem Marketing Director at e-peas. Most IoT devices still rely on a disposable battery, and that battery ...

Morse Micro’s Wi-Fi HaLow™ USB network adapters use the MM8108 Wi-Fi HaLow chipset and are available in USB-A and USB-C ...

Ironwood Electronics has introduced a 70-GHz elastomer socket designed for 37.5 × 37.5-mm BGA packages with a 0.65-mm pitch.

TDK Corporation has expanded its CN series of low-resistance soft-termination SMD MLCCs with a 100 V X7R component that ...

Sensor fusion relies on a variety of software tools to integrate multimodal sensor data into a single unified spatial model.

How VC MEMS accelerometers, angular rate sensors, and 6DoF configurations support motion studies Test articles rarely move in ...