Continuous edge AI workloads are pushing thermal limits, making advanced microcooling critical for sustained performance in ...
AI glasses shipments surged 263% in 1H 2026, with display-less models accounting for 96% of the global market.
Singapore-based Nexstrom will use new funding to scale wafer-level 2D material growth for advanced semiconductor manufacturing.
PATEO and Arm will explore automotive physical AI workloads spanning perception, interaction, and intelligent vehicle control.
Introduction Autonomous Mobile Robots (AMRs) are transforming modern factories, warehouses, and logistics operations by ...
Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive the industry's ...
Cadence's new RTL generation agent automates specification-to-code workflows, targeting early power, performance, and area ...
Besxar's first space mission tests vacuum-enabled wafer processing, laying groundwork for autonomous compound semiconductor ...
GUC will offer proteanTecs monitoring across custom SoCs to improve power, performance, reliability and field diagnostics.
Global Unichip Corp.’s (GUC) design-ready HBM4E PHY and Controller IP has been adopted in customer AI ASICs. Implemented on ...
Lattice's Mach-N2 combines higher logic density, integrated flash and post-quantum cryptography for secure system control.
NanoBridge adopts Siemens' Precision FPGA Synthesis to streamline development of non-volatile FPGAs for demanding ...
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