Continuous edge AI workloads are pushing thermal limits, making advanced microcooling critical for sustained performance in ...
AI glasses shipments surged 263% in 1H 2026, with display-less models accounting for 96% of the global market.
Singapore-based Nexstrom will use new funding to scale wafer-level 2D material growth for advanced semiconductor manufacturing.
PATEO and Arm will explore automotive physical AI workloads spanning perception, interaction, and intelligent vehicle control.
Cadence's new RTL generation agent automates specification-to-code workflows, targeting early power, performance, and area ...
Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive the industry's ...
Besxar's first space mission tests vacuum-enabled wafer processing, laying groundwork for autonomous compound semiconductor ...
Lattice's Mach-N2 combines higher logic density, integrated flash and post-quantum cryptography for secure system control.
NanoBridge adopts Siemens' Precision FPGA Synthesis to streamline development of non-volatile FPGAs for demanding ...
TI's TMCS2100-Q1 combines multiaxial sensing and proprietary algorithms to improve current measurement accuracy in EV ...
Global Unichip Corp.’s (GUC) design-ready HBM4E PHY and Controller IP has been adopted in customer AI ASICs. Implemented on ...
Kioxia advances NAND-based CXL memory to supplement DRAM, targeting higher-capacity, lower-cost memory for AI workloads.
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