Data centers are notorious energy consumers. On the one hand, ongoing efforts attempt to reduce electronics power to keep overall power from growing. On the other hand, data centers are provided with ...
Even though the benefits are accepted, a combined hardware/software development flow is hampered by a lot of challenges.
Rising power density and chiplet complexity drive thermal considerations earlier in the design process. Thermal is becoming an architectural constraint, requiring trade-offs in power, performance, ...
Build configurable PCIe subsystems spanning local expansion, shared resource domains, and longer-reach topologies.
Transforming established SoC design paradigms into system-level fabrics capable of supporting next-generation AI, HPC, and data center workloads.
Synopsys’ 3D PCIe 6.0 test-chip demonstration shows that 64.0 GT/s PCIe connectivity, with up to 128.0 GB/s delivered through an 8-lane configuration using PAM4 signaling, can be implemented and ...
One toolchain means one team. The DSP specialists, the ML engineers, and the firmware developers work in the same environment ...
Researchers at Rensselaer Polytechnic Institute and IBM T.J. Watson Research Center published a technical paper titled “REACH: Controller-Managed Long-Span ECC for HBM AI Inference.” Abstract Excerpt: ...
Researchers at National Yang Ming Chiao Tung University and TSMC published a technical paper titled “High contrast EUV ...
Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a ...
Researchers at Princeton University, MIT CSAIL, and EPFL published a technical paper titled “Efficient Hardware ...
Sub-2nm manufacturing is blurring traditional process boundaries as shrinking dimensions and tighter margins make test, metrology, inspection, and manufacturing increasingly interdependent.
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