MediaTek, TSMC
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MediaTek launched its Dimensity 9600 Pro on September 15 using Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) 2-nanometer technology, putting TSMC’s newest node into a flagship mobile chip.
MediaTek's new Dimensity 9600 Pro will power a variety of premium smartphones across the next twelve months, and has now been put through CPU and GPU benchmarks aboard an OEM reference design unit.
The two companies will work on integrating Nvidia technology with MediaTek's custom AI chip business as well as other areas such as PCs and cars.
The deal, part of MediaTek's record $3.9 billion bond offering, ties Nvidia's chip ecosystem to a Taiwanese rival building its own AI accelerator business.
MediaTek has launched the Dimensity 9600M alongside the more powerful Dimensity 9600 Pro. The new chipset will power the standard Vivo X500, while the
MediaTek Dimensity 9600 Pro with 2nm process, 4.55GHz Dual Ultra Cores and Dimensity 9600M announced
The CPU architecture is supported by 16MB of L3 cache and 10MB of System Level Cache (SLC), contributing to a combined 34.5MB cache pool. MediaTek claims the chip delivers up to 17% higher single-core performance, 15% higher multi-core performance, and a 61% reduction in multi-core power consumption compared to the previous generation.
Alongside the latest MediaTek chip, Oppo has also confirmed that its new Find X10 Pro Max flagship will be available in global markets. It doesn’t come as a huge surprise, but Oppo has confirmed that the Find X10 Pro Max will be coming to “international markets,