Design And Reuse

Ceva Appoints Semiconductor Industry Veteran Ziv Hammer as Executive Vice President to Lead Connectivity & Sensing

(NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced the appointment of, Connectivity & Sensing, reporting to Chief Executive Officer Amir Panush. The ...
Design And Reuse

Clock Domain Crossing Sign-Off with Microarchitecture Analysis: 20X Better Precision

Real Intent’s new Microarchitecture Analysis technology lets us achieve a 20X improvement in Meridian CDC’s violation report precision. Traditionally, clock domain crossing tools have relied on ...
Design And Reuse

Samsung and Qualcomm reopen 2nm talks as yield gap with TSMC narrows

Qualcomm weighs dual-sourcing as Samsung's 2nm yields climb but still trail TSMC ahead of Snapdragon Summit By Hwang Min-gyu, biz.chosun.com ...
Design And Reuse

AI Drives New Semiconductor Patent Race Across Computing, Memory and Custom Silicon

If current trends hold, AI could be shifting from a temporary tailwind to the central driver of long-term semiconductor R&D investment. Over the past five years, patent filings sitting directly at the ...
Design And Reuse

Synopsys Integrates Chip-to-System Design After Ansys Acquisition

Synopsys is expanding its semiconductor design platform following its acquisition of Ansys, targeting further growth in South Korea’s semiconductor market.
Design And Reuse

Keysight Joins Verizon 6G Innovation Forum to Accelerate Pre-Standard 6G Validation

Keysight Technologies has joined the Verizon 6G Innovation Forum, adding independent design, emulation, and test expertise to a growing ecosystem focused on pre-standard 6G research, prototyping, and ...
Design And Reuse

SiFive and AMD Collaborate to Optimize AMD ROCm on RISC-V Datacenter Servers

September 15, 2026 – Today at the AI Infra Summit, SiFive, Inc., and AMD showcased a demonstration of AMD ROCm™ running on SiFive’s recently announced BigSky Datacenter Development Platform. In a ...
Design And Reuse

Samsung Electronics to Expand DDR5 Module Output Only Through Outsourcing

Samsung Electronics plans to outsource all additional production of conventional memory modules as it focuses its in-house capacity on high-value memory products such as high-bandwidth memory (HBM).
Design And Reuse

Synopsys Joins Arm Total Design for Physical AI to Advance Autonomous Systems

Physical AI is one of the hardest engineering problems the technology industry has faced. Autonomous vehicles, industrial robots, delivery drones, surgical assistants, and humanoids have to sense the ...
Design And Reuse

Andes Technology Honors Quintauris as 2026 Partner of the Year

Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, today presents Quintauris, a global leader in RISC‑V based solutions, with Andes 2026 ...
Design And Reuse

ST is transforming semiconductor R&D: Moving from physical iteration to digital anticipation

The creation of this new R&D Digital Twin Center in Castelletto, Italy marks an important step in transforming how we conduct semiconductor research and development, including how quickly we do so.
Design And Reuse

Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture

Cadence (Nasdaq: CDNS) today announced that its Tensilica IP Group and Analog Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further ...