Optics

ficonTEC introduces industry’s first, ATE agnostic, top-sided electro-optical wafer-level tester

ficonTEC proudly announces the release of a new single-sided electro-optical wafer-level tester, a first-of-its-kind solution fully compatible with the world’s two largest semiconductor ATE (automated ...
Optics

VLC Photonics receives new Wafer-level Test system from ficonTEC

In order to support the growth of the Photonic Integrated Circuit (PIC) market and be able to timely serve the scaling of its customers when moving to engineering and pilot production stages, VLC ...
Business Wire

OmniVision Unveils World’s First Automotive Wafer-Level Camera Module, Enabling Better Driver Monitoring Systems in More Vehicles

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...
Seeking Alpha

FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...
Business Wire

OmniVision’s New Medical Wafer-Level Camera Module Improves Image Quality for Single-Use Endoscopy in Smallest Parts of Anatomy

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...
Semiconductor Engineering

Easing The Stress For Package-Level Burn-In

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...