Responding to heightened global awareness of the need to reduce harmful substances in the environment — especially at the manufacturing source — IC Interconnect announced Thursday its lead-free wafer ...

TAIPEI, Taiwan — Advanced Semiconductor Engineering Inc., a supplier of packaging and testing services, has said that it has electroplated wafer bumping technology on 200-mm wafers and has begun a ...

MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH) announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc.

Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...

Taiwan-based Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) have dived into 12-inch wafer bumping volume production, but Orient Semiconductor Electronics (OSE ...

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement in processing ...

MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the SEMICON ...

Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...