Building an integrated circuit (IC) requires various physical and chemical processes to be performed on a semiconductor (e.g., silicon) substrate. Millions of transistors can be fabricated and wired ...

To help chipmakers conquer the time-to-market yield challenges of 45nm chip manufacturing, including the ones associated with immersion lithography, KLA-Tencor Inc. is launching a new overlay ...

Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

Tokyo, Japan-based Canon Inc. today announced three new lithography tools for 300mm wafers. Canon’s San Jose-based subsidiary, Canon U.S.A. Inc., today started taking orders for a 300mm-compatible ...

(MENAFN- PR Newswire) The EVG40 D2W can be used for any D2W bonding application, including chiplet integration, high-bandwidth memory (HBM) stacks, and 3D system on chip (SoC) integration processes, ...

EUV lithography is creating a new set of challenges on the photomask side for which there currently are no simple solutions. While lithography is viewed as a single technology, EUV actually is a ...

Nikon has this week announced the development of its new NSR-S636E ArF Immersion Scanner to provide industry-leading lithography solutions and enable customers to advance “semiconductor manufacturing ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation introduces the NSR-S631E ArF immersion scanner, ensuring world-class device patterning and optimum fab productivity to fully satisfy real-world 7 nm node ...

Newly-launched platform based on Eulitha’s proprietary Displacement Talbot Lithography technology enables low-cost, high-volume production of photonic devices such as waveguides for augmented reality ...